Patent · US Active

Method for coating a substrate with a lacquer and device for planarising a lacquer layer

US10232405B2 · kind B2 · utility

0Cited by

3References

11Claims

0Family size

Assignee

SUSS MICROTEC LITHOGRAPHY GMBH · DE

Inventors

Katrin Fischer · Stuttgart, DE
Florian Palitschka · Gauting, DE
Johannes Platen · Hohenwestedt, DE
Kento Kaneko · Munich, DE

Key dates

Filing date	Sep 22, 2015
Grant date	Mar 19, 2019
Priority date	—
Expiry date	Dec 21, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG03F7/168
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method for coating a substrate with a lacquer is disclosed. First, the lacquer is uniformly applied to the substrate. Then, the solvent proportion of the lacquer applied to the substrate is reduced, and the coated substrate is exposed to a solvent atmosphere. In some embodiments, the lacquer is heated. The invention also relates to a device for planarizing a lacquer layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.