Transient liquid phase sinter pastes and application and processing methods relating thereto
US10232472B2 · kind B2 · utility
1Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2015 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Jun 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to transient liquid phase sinter pastes for electronic interconnects, and sinter paste application and processing methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.