Methods and apparatus for forming a polymer layer around a structure using a plurality of protrusions
US10232531B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2014 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Jan 12, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/753
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method may involve positioning a structure on a plurality of protrusions that extend from a surface of a molding piece, wherein the structure comprises a sensor or an electronic component; forming, using the molding piece, a body-mountable device by forming a polymer layer around the structure positioned on the plurality of protrusions, such that the structure is at least partially enclosed by the polymer layer, wherein the polymer layer defines a first side of the body-mountable device and a second side of the body-mountable device opposite the first side, and wherein the surface of the molding piece supports the polymer layer as the polymer layer is being formed; and removing the body-mountable device from the molding piece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.