Methods for securing a shrinkable film to a paperboard substrate and methods for making paperboard containers therefrom
US10232580B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2015 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Jun 4, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB31B2120/40
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Methods for securing a shrinkable film to a paperboard substrate and methods for making paperboard containers therefrom. In one or more embodiments, a band of adhesive may be applied about a perimeter of a paperboard substrate having a first edge and a second edge opposed to one another and a third edge and a fourth edge opposed to one another. The band of adhesive may at least partially surround a first area that is substantially free from the adhesive. A second area that may be substantially free from the adhesive may be located between the third edge and the first area. The first area and the second area may be separated by the band of adhesive. A shrinkable film may be secured to the paperboard substrate with the adhesive to produce a paperboard blank. The third edge and the fourth edge may be overlapped to form a sidewall. A bottom panel may be secured to the sidewall at or adjacent the second edge. The first edge may be curled to form a brim.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.