Patent · US Active

Pressure-sensitive adhesive tapes for the adhesive bonding of windows more particularly in mobile equipment

US10232586B2 · kind B2 · utility

2Cited by

2References

16Claims

0Family size

Assignee

tesa SE · DE

Inventors

Thilo Dollase · Hamburg, DE
Anika PETERSEN · Heidmühlen, DE
Elisabetta Ardente · Hamburg, DE
Franziska EBERHARDT · Hamburg, DE
Stephan Zollner · Hamburg, DE
Kai Ellringmann · Hamburg, DE
Bernd Lühmann · Norderstedt, DE

Key dates

Filing date	Jul 8, 2014
Grant date	Mar 19, 2019
Priority date	—
Expiry date	Dec 16, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH04M1/0266
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

Composite made of two substrates for use for optical, electronic and/or precision-engineered equipment, comprising a first substrate and a second substrate and, arranged so as to connect the first substrate to the second substrate, an adhesive layer, wherein the adhesive layer comprises an adhesive which has, relative to the mixture, (a) from 60% by weight to 90% by weight of a first polymer component based on polyacrylate and (b) from 10% by weight to 40% by weight of a second polymer component based on elastomers, where the second polymer component is essentially not miscible with the first polymer component, so that the adhesive is present in at least two separate phases in the adhesive layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.