Method and device for printing on heated substrates
US10232655B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2016 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Apr 18, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/08
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.