Laser processing of slots and holes
US10233112B2 · kind B2 · utility
4Cited by
128References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2016 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Jan 29, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24273
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.