Patent · US Active

Extrudable hotmelt adhesives based on branched SIS polymers

US10233364B2 · kind B2 · utility

4Cited by

1References

14Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Marcus Heemann · Goldkronach, DE
Sebastian Kostyra · Monheim, DE
Eckhard Puerkner · Dressendorf, DE
Dirk Kasper · Goldkronach, DE

Key dates

Filing date	Jun 16, 2016
Grant date	Mar 19, 2019
Priority date	—
Expiry date	Mar 15, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2467/00
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The invention relates to a hotmelt adhesive comprising 10 to 40 wt % of at least one branched styrene-isoprene-styrene block copolymer having a weight percentage diblock fraction in the polymer of less than 30% and a melt flow index of less than 5 g/10 minutes at 200° C. under a test load of 5 kg; 0 to 40 wt % of at least one styrene polymer or styrene copolymer; 20 to 60 wt % of at least one tackifying resin; 0 to 15 wt % of at least one plasticizer; and 0 to 16 wt % of additives and auxiliaries selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers. Also included are the use thereof to bond films, and products, especially packaging products, that include this adhesive.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.