Patent · US Active

Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids

US10233555B2 · kind B2 · utility

0Cited by
25References
22Claims
0Family size

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Key dates

Filing dateSep 11, 2008
Grant dateMar 19, 2019
Priority date
Expiry dateJul 20, 2031

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC25D3/48
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

The invention relates to an electrolytic deposition in the form of a gold alloy with a thickness of between 1 and 800 microns and which includes copper. According to the invention, the deposition includes indium as the third main compound. The invention concerns the field of electroplating methods.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.