Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
US10233555B2 · kind B2 · utility
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25References
22Claims
0Family size
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Key dates
| Filing date | Sep 11, 2008 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Jul 20, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/48
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to an electrolytic deposition in the form of a gold alloy with a thickness of between 1 and 800 microns and which includes copper. According to the invention, the deposition includes indium as the third main compound. The invention concerns the field of electroplating methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.