Floor panel

US10233655B2 · kind B2 · utility

Assignee

• FLOORING INDUSTIES LIMITED, SARL · LU

Inventors

• Laurent Meersseman · Kortrijk, BE
• Martin Segaert · Ieper, BE
• Bernard Thiers · Oostrozebeke, BE
• Benjamin CLEMENT · American Fork, US
• Christophe Maesen · Lichtervelde, BE

Key dates

• Filing date: Oct 12, 2018
• Grant date: Mar 19, 2019
• Expiry date: Oct 12, 2038

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24777
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A floor panel may include a substrate and a top layer located above the substrate. The substrate may include a closed cell foamed synthetic material layer with fillers, and have an average density of more than 300 kilograms per cubic meter. The top layer may include a back layer, a printed synthetic material film above the back layer, and a transparent or translucent synthetic material wear layer above the printed synthetic material film. The back layer may include a vinyl compound with fillers, and have a thickness of at least 45 percent of the thickness of the top layer. The floor panel may include first mechanical coupling parts at the pair of long edges and second mechanical coupling parts at the pair of short edges. The first mechanical coupling parts may allow horizontal and vertical locking of two of such floor panels using a turning movement along the respective long edges.