Magnetic field sensor integrated circuit with integral ferromagnetic material
US10234513B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2012 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Feb 7, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A magnetic field sensor includes a lead frame, a semiconductor die supporting a magnetic field sensing element, a non-conductive mold material enclosing the die and a portion of the lead frame, a ferromagnetic mold material secured to the non-conductive mold material and a securing mechanism to securely engage the mold materials. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet. The ferromagnetic mold material may be tapered and includes a non-contiguous central region, as may be an aperture or may contain the non-conductive mold material or an overmold material. Further embodiments include die up, lead on chip, and flip-chip arrangements, wafer level techniques to form the concentrator or bias magnet, integrated components, such as capacitors, on the lead frame, and a bias magnet with one or more channels to facilitate overmolding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.