Fingerprint sensor-compatible overlay material
US10235558B2 · kind B2 · utility
0Cited by
16References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2017 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Mar 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/213
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A fingerprint sensor-compatible overlay material which uses anisotropic conductive material to enable accurate imaging of a fingerprint through an overlay is disclosed. The anisotropic conductive material has increased conductivity in a direction orthogonal to the fingerprint sensor, increasing the capacitive coupling of the fingerprint to the sensor surface, allowing the fingerprint sensor to accurately image the fingerprint through the overlay. Methods for forming a fingerprint sensor-compatible overlay are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.