Camera module and electronic apparatus to lower risk of breakage of camera module
US10236312B2 · kind B2 · utility
3Cited by
1References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 2, 2016 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Feb 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present technology relates to a camera module and an electronic apparatus that can lower the risk of breakage. An imaging element has a light receiving surface to receive light, and is flip-chip mounted on a base. A joining material is joined to the optical back surface of the imaging element so that a space is formed between the joining material and a back-surface-side member provided on the side of the optical back surface on the opposite side of the imaging element from the light receiving surface. The present technology can be applied to camera modules and the like that capture images, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.