Mounting assembly and lighting device
US10236429B2 · kind B2 · utility
0Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2014 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Mar 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16245
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting assembly (10) is disclosed for mounting and connecting an electrical device, in particular a light emitting diode. The mounting assembly (10) comprises a mounting element (12) including at least two metal layers (14, 16) each having a top surface (24) and a bottom surface (28). Top contact pads are formed at the top surface of each of the metal layers for providing a planar electrical and thermal contact to the electrical device. Bottom contact pads are formed at the bottom surface of each of the metal layers for providing a planar electrical and thermal contact to a mounting board (34).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.