Manufacturing apparatus for flexible electronics
US10236446B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2016 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Jun 8, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1978
Abstract
This application discloses a method of forming a flexible substrate using a detachment apparatus. The flexible substrate includes a debonding region, and one or more edge regions located in proximity to one or more edges of the flexible substrate. The detachment apparatus detaches the one or more edge regions of the flexible substrate from a rigid carrier that is configured to support the flexible substrate device, and detach the debonding region of the flexible substrate from the rigid carrier to which a bottom surface of the debonding region is configured to adhere. Specifically, the detachment apparatus detaches the debonding region by contacting the top surface of the flexible substrate at a plurality of suction locations located on the debonding region of the flexible substrate, and applying detachment force at the plurality of suction locations to peel the flexible substrate off the rigid carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.