Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US10237976B2 · kind B2 · utility
2Cited by
16References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 26, 2015 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Mar 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/032
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. The metal particles preferably have a mean particle size of 1 nm or more and 500 nm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.