Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same
US10238018B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2017 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Dec 8, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/04
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same are provided. In some embodiments, different insulation components of different layers of a stack may be attached to the same surface of a shield component during a single attachment (e.g., lamination) operation to attenuate the spacing between the different insulation components attached to the shield component. Limiting the size of a spacing between adjacent insulation components along a shield component of a shield structure may limit the size of an exposed portion of the shield component, which may limit the opportunity for that exposed shield component portion to be shorted to another structure (e.g., a support structure of an electronic device that includes the shield structure).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.