Patent · US Active

Implantable medical devices with flexible interconnect having strain relief

US10238879B2 · kind B2 · utility

0Cited by
7References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 2, 2016
Grant dateMar 26, 2019
Priority date
Expiry dateJul 2, 2036

Classification

  • Technology area (CPC A)Human Necessities
  • CPC primaryA61N1/3956
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.