Implantable medical devices with flexible interconnect having strain relief
US10238879B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2016 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Jul 2, 2036 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3956
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.