Systems and processes that singulate materials
US10239160B2 · kind B2 · utility
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264References
14Claims
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Assignee
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Key dates
| Filing date | Sep 21, 2011 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Sep 21, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P40/57
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.