Stage for cutting substrate and substrate-cutting apparatus
US10239161B2 · kind B2 · utility
1Cited by
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20Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 24, 2016 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Sep 14, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided are a stage for cutting a substrate and a substrate-cutting apparatus. The stage for cutting a substrate includes: a plurality of cell areas, each of the cell areas including a first opening; an edge area at an outer side of the cell areas, the edge area including a second opening having a diameter that is larger than a diameter of the first opening; a dummy area between adjacent ones of the cell areas; and a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.