Method of manufacturing a floor board
US10239346B2 · kind B2 · utility
14Cited by
39References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 3, 2015 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Apr 3, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB44F9/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of manufacturing a floor board comprises the steps of supplying a panel, printing a curable substance or surface removing substance onto the panel in a predefined pattern for creating an elevation on the panel at the pattern or removing a portion of the surface of the panel at the pattern, respectively, and curing the curable substance or removing any re-action products of the surface removing substance and the panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.