Microelectromechanical device with protection for bonding
US10239748B2 · kind B2 · utility
2Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2014 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Jan 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/005
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microelectromechanical device includes: a substrate; a semiconductor die, bonded to the substrate and incorporating a microstructure; an adhesive film layer between the die and the substrate; and a protective layer between the die and the adhesive film layer. The protective layer has apertures, and the adhesive film layer adheres to the die through the apertures of the protective layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.