Portable, liquid free, electroless, electrochemical deposition of metal on conductive and nonconductive surfaces
US10240244B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | Mar 12, 2015 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Apr 20, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7722
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Electroless plating is accomplished by forming a metal salt and a polymer solution as a binder into a solid electrolyte block and depositing metal on the surface by rubbing or brushing the solid electrolyte block onto a surface with minimal or no water and without an electric potential/power source. The solid electrolyte block is also conformable/moldable and can be used to deposit metal on to both conductive and nonconductive surface through electroless deposition process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.