Thermally stable polycrystalline diamond with enhanced attachment joint
US10240398B2 · kind B2 · utility
1Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2013 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Dec 23, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/72
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to an industrial device, such as a drill bit including a thermally stable polycrystalline diamond (TSP) table coupled to a substrate via an attachment joint, with at least one attachment material located in the attachment joint. At least one of the attachment materials includes a metal or metal alloy and an additive material having a hardness higher than the metal or metal alloy or a coefficient of thermal expansion lower than that of the metal or metal alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.