Thermal airflow sensor
US10240957B2 · kind B2 · utility
1Cited by
0References
2Claims
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Assignee
Inventors
Key dates
| Filing date | May 14, 2018 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | May 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.