High temperature heating system
US10241017B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2012 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Nov 16, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0482
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.