Encapsulation of electronic components in polymer materials
US10242925B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 19, 2015 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Mar 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to an electronic component (1) comprising at least one semiconductor chip (4) and at least one substrate (6), the semiconductor chip (4) being encapsulated in a polyorganosiloxane resin (3), which is the result of hardening a composition comprising at least: one portion (A) comprising at least one polyorganosiloxane (A1) which contains at least two —CH═CH2 reactive groups per molecule; one portion (B) comprising a polyorganosiloxane (B1) which comprises at least two Si—H groups per molecule; and at least one hydrosilation catalyst (C1), the components (A1) and (B1) being in quantities such that the molar ratio of Si—H/—CH═CH2 in the composition is no lower than 0.4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.