Molded resin-sealed power semiconductor device
US10242930B2 · kind B2 · utility
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1References
6Claims
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Assignee
Inventor
Key dates
| Filing date | May 12, 2017 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | May 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Freedom of layout is increased, and a small, low-priced molded resin-sealed power semiconductor device is obtained. A molded resin-sealed power semiconductor device includes a power semiconductor element, a lead frame having a thick portion on which the power semiconductor element is mounted and a thin portion thinner than the thick portion, an inner lead that electrically connects the power semiconductor element and lead frame, and a molded resin that seals the power semiconductor element, lead frame, and inner lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.