Optical electronic-chip identification writer using dummy C4 bumps
US10242951B1 · kind B1 · utility
3Cited by
9References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 30, 2017 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Nov 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention are directed to a method and resulting structures for forming optically readable chip identification (CID) codes using dummy controlled collapse chip connection (C4) bumps. In a non-limiting embodiment of the invention, a product chip is formed on a wafer. A chip location identifier including a plurality of controlled collapse chip connection (C4) bumps is formed on a surface of the product chip. The chip location identifier encodes a unique location of the product chip on the wafer prior to dicing. The plurality of C4 bumps are arranged into one or more optically readable alphanumeric characters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.