Compartment shielding in flip-chip (FC) module
US10242957B2 · kind B2 · utility
9Cited by
12References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2015 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Feb 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Ground shielding is achieved by a conductor shield having conductive surfaces that immediately surround individual chips within a multichip module or device, such as a multichip module or device with flip-chip (FC) bumps. Intra-module shielding between individual chips within the multichip module or device is achieved by electromagnetic or radio-signal (RF) isolation provided by the surfaces of the conductor shield immediately surrounding each of the chips. The conductor shield is directly connected to one or more grounded conductor portions of a substrate or interposer to ensure reliable grounding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.