Sensor and manufacturing method thereof
US10242963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2016 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Apr 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a manufacturing method of a sensor including the following steps. A mold having a cavity is provided. At least one chip is disposed in the cavity. The chip has an active surface and a back surface opposite to each other. The active surface faces toward a bottom surface of the cavity. A polymer material is filled in the cavity to cover the back surface of the chip. A heat treatment is performed, such that the polymer material is solidified to form a polymer substrate. A mold release treatment is performed to isolate the polymer substrate from the cavity. A plurality of conductive lines are formed on a first surface of the polymer substrate. The conductive lines are electrically connected with the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.