Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

US10242974B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Lutz Hoeppel · Alteglofsheim, DE
• Juergen Moosburger · Lappersdorf, DE
• Andreas Ploessl · Regensburg, DE
• Patrick Rode · Regensburg, DE
• Peter Nagel · Highlands, US
• Dominik Scholz · Regensburg, DE

Key dates

• Filing date: Jan 21, 2015
• Grant date: Mar 26, 2019
• Expiry date: Jan 21, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/882
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for producing a plurality of optoelectronic semiconductor components (100) is provided, comprising the following steps: a) providing an auxiliary carrier (2); b) providing a plurality of semiconductor chips (10), wherein each of the semiconductor chips has a carrier body (12) and a semiconductor body (4) arranged on an upper side (22) of the carrier body; c) attaching the plurality of semiconductor chips on the auxiliary carrier, wherein the semiconductor chips are spaced apart from one another in a lateral direction (L) and wherein the semiconductor bodies are facing the auxiliary carrier, as seen from the carrier body; d) forming a scattering layer (18), at least in regions between the semiconductor bodies of adjacent semiconductor chips; e) forming a composite package (20); f) removing the auxiliary carrier (2); and g) individually separating the composite package into a plurality of optoelectronic semiconductor components (100).