System-in-package image sensor
US10243014B2 · kind B2 · utility
4Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2018 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Feb 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
Abstract
A method of image sensor package fabrication includes forming a cavity in a ceramic substrate, and placing an image sensor in the cavity in the ceramic substrate. An image sensor processor is also placed in the cavity in the ceramic substrate, and the image sensor and the image sensor processor are wire bonded to electrical contacts. Glue is deposited on the ceramic substrate, and a glass layer is placed on the glue to adhere the glass layer to the ceramic substrate. The image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.