Patent · US Active

Substrate features for enhanced fluidic assembly of electronic devices

US10243098B2 · kind B2 · utility

1Cited by

27References

22Claims

0Family size

Assignee

eLux, Inc. · US

Inventors

David Robert Heine · Seminole, US
Sean Mathew Garner · Elmira, US
Avinash Tukaram Shinde · Pune, IN

Key dates

Filing date	Jan 1, 2018
Grant date	Mar 26, 2019
Priority date	—
Expiry date	Jan 1, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/831
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate. In some cases, embodiments include a substrate including a plurality of wells each having a sidewall where a through hole via extends from a bottom of at least one of the plurality of wells; and a post enhanced diode including a post extending from a top surface of a diode structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.