Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material
US10244627B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Dec 21, 2015 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Dec 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An object is to provide a substrate for a printed wiring board that has good circuit formability while maintaining adhesion strength between a conductive layer (2) and a base film (1). The substrate includes a base film having an insulating property (1) and a conductive layer (2) formed on at least one surface of the base film (1). The maximum height Sz, which is defined in ISO25178, of the surface of the base film (1) is 0.05 μm or more and less than 0.9 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.