Method and apparatus for curing thin films on low-temperature substrates at high speeds
US10244636B2 · kind B2 · utility
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2References
8Claims
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Key dates
| Filing date | Apr 4, 2017 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | May 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite film is disclosed. The composite film includes a substrate, a thermal barrier layer located on top of the substrate, wherein the thermal barrier layer has a higher decomposition temperature than the substrate, and a thin film located on top of the thermal barrier layer, wherein the thin film is to be thermally processed by a pulsed light from a flashlamp.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.