Thermal distribution assembly in an electronic device
US10244659B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2017 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Sep 21, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.