Patent · US Active

Machine for workpiece processing

US10245696B2 · kind B2 · utility

3Cited by

30References

18Claims

0Family size

Assignee

TRUMPF LASER GMBH · DE

Inventors

Juergen Doettling · Schramberg, DE
Robert Ganter · Gerlingen, DE
Rainer Banholzer · Bad Dürrheim, DE

Key dates

Filing date	Mar 17, 2015
Grant date	Apr 2, 2019
Priority date	—
Expiry date	Jul 7, 2035

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23Q11/0891
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A workpiece processing machine includes a separation device for dividing an operating space into a processing region and at least one additional operating region, a laser processing head configured to process the workpiece, and a rotary workpiece changer having a rotatable workpiece support for transporting the workpiece between the processing region and the at least one additional operating region by an opening. The rotatable workpiece support has a protection wall configured to shield the at least one additional operating region with respect to the processing region. The separation device has a protection element movable between a processing position and a transport position and configured to be in abutment with the protection wall in the processing position to close the opening and spaced apart from the protection wall in the transport position. A spacing between the processing position and the transport position is adjustable based on a dimension of the workpiece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.