Patent · US Active

Method and arrangement for pre-curing an adhesive layer

US10245818B2 · kind B2 · utility

0Cited by
4References
12Claims
0Family size

Assignees

Inventors

Key dates

Filing dateDec 13, 2015
Grant dateApr 2, 2019
Priority date
Expiry dateJan 20, 2037

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2605/00
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

The invention provides a method for pre-curing an adhesive layer bonding a first component to a second component. The adhesive layer is heated by treating an adhesive layer component as heating the first component with a pair of electrodes that are in electrical contact with a surface of the first component, the pair of electrodes applying a predetermined electrical current (I1, I2) to the first component. The invention further provides an arrangement for pre-curing a layer of adhesive.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.