Method and arrangement for pre-curing an adhesive layer
US10245818B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 13, 2015 |
| Grant date | Apr 2, 2019 |
| Priority date | — |
| Expiry date | Jan 20, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2605/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention provides a method for pre-curing an adhesive layer bonding a first component to a second component. The adhesive layer is heated by treating an adhesive layer component as heating the first component with a pair of electrodes that are in electrical contact with a surface of the first component, the pair of electrodes applying a predetermined electrical current (I1, I2) to the first component. The invention further provides an arrangement for pre-curing a layer of adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.