Electroless nickel plating solution and method
US10246778B2 · kind B2 · utility
2Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2013 |
| Grant date | Apr 2, 2019 |
| Priority date | — |
| Expiry date | Mar 9, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/36
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.