CTE-matched heat pipe
US10247486B2 · kind B2 · utility
0Cited by
11References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2017 |
| Grant date | Apr 2, 2019 |
| Priority date | — |
| Expiry date | Mar 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.