Semiconductor device
US10249750B2 · kind B2 · utility
1Cited by
0References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2018 |
| Grant date | Apr 2, 2019 |
| Priority date | — |
| Expiry date | Apr 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8503
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first semiconductor layer. A second semiconductor layer is disposed on the first semiconductor layer. A structure layer is disposed on the second semiconductor layer. A metal film covers a side surface of the first semiconductor layer, a side surface of the second semiconductor layer, and an upper surface of the structure layer. A flexible substrate covers the metal film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.