Microwave modulation device
US10249949B2 · kind B2 · utility
2Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2018 |
| Grant date | Apr 2, 2019 |
| Priority date | — |
| Expiry date | Jan 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B13/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A microwave modulation device includes a first radiator; a second radiator disposed on the first radiator; a third radiator disposed on the second radiator; a support structure disposed between the first radiator and the second radiator; and a modulation structure disposed between the second radiator and the third radiator. A microwave-transmission layer is located among the space defined by the first radiator, the second radiator, and the support structure. The microwave-transmission layer is gas, substantially vacuum, liquid or insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.