Circuit board and conductive pattern structure
US10251259B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2016 |
| Grant date | Apr 2, 2019 |
| Priority date | — |
| Expiry date | Sep 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.