Mold transfer assemblies and methods of use
US10252329B2 · kind B2 · utility
1Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2015 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | Mar 28, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C29/06
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and a thermal heat sink. The transfer housing exhibits one or more thermal properties to control a thermal profile of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.