Multilayer composite comprising an EVOH layer

US10252498B2 · kind B2 · utility

Assignee

• EVONIK DEGUSSA GMBH · DE

Inventors

• Jasmin Berger · Dortmund, DE
• Rainer Goering · Borken, DE
• Klaus Gahlmann · Marl, DE
• Michael Boeer · Olfen, DE
• Mario Resing · Stadtlohn, DE

Key dates

• Filing date: Mar 17, 2016
• Grant date: Apr 9, 2019
• Expiry date: Jun 18, 2036

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K3/041
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A multilayer composite containing the following layers: I. a first layer (layer I) of a molding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; II. a second layer (layer II) of a molding compound containing at least 60 wt. % of EVOH; III. a third layer of a polyamide molding compound, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.