Apparatus and methods for micro-transfer-printing
US10252514B2 · kind B2 · utility
6Cited by
85References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2016 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | Dec 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1034
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.