Padded element, and process and mold for producing same
US10252655B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2014 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | May 21, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/58
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There is disclosed a padded element. In one embodiment, the padded element comprises a molded foam topper portion and a molded foam substrate portion secured with respect to the molded foam topper portion. The molded foam topper portion and the molded foam substrate portion have a different indentation force deflection at 25% thickness when measured pursuant to ASTM 3574-B1. In another embodiment, the padded element comprises a molded foam topper portion and a molded foam substrate portion secured with respect to the molded foam topper portion via an interference fit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.