Glass composition, glass frit containing same, glass paste containing same, and electrical/electronic component obtained using same
US10252938B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2012 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | Nov 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention aims at providing a lead-free glass composition that can be soften and flowed at a firing temperature that is equal to or lower than that of conventional low melting point lead glass. Furthermore, the present invention aims at providing a lead-free glass composition having fine thermal stability and fine chemical stability in addition to that property. The lead-free glass composition according to the present invention is characterized by comprising at least Ag2O, V2O5 and TeO2 when the components are represented by oxides, wherein the total content ratio of Ag2O, V2O5 and TeO2 is 75 mass % or more. Preferably, the lead-free glass composition comprises 10 to 60 mass % of Ag2O, 5 to 65 mass % of V2O5, and 15 to 50 mass % of TeO2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.