Waterborne curing compositions for electrodeposition and radiation curing
US10253206B2 · kind B2 · utility
0Cited by
9References
13Claims
0Family size
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Key dates
| Filing date | Oct 23, 2014 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | Oct 23, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/05
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to waterborne curing compositions for electrodeposition and radiation curing and processes to obtain such compositions. The compositions are characterized in that an ethylenically unsaturated compound (b), is dispersed in an aqueous solution by an at least partially neutralized (meth)acrylic modified amine epoxy adduct. The compositions of the invention are particularly suitable for coating metallic materials and temperature sensitive materials such as electrically conductive plastic materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.